BLIND & BURIED VIAS PCB

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BLIND & BURIED VIAS PCB

PCB Products | BLIND & BURIED VIAS PCB

8 Layers Buried & Blind Via PCB

MOQ & PRICE : To be negotiated

Blind and buried vias are used to connect between layers of a PCB where space is at a premium. A Blind Via connects an outer layer to one or more inner layers but does not go through the entire board. A Buried Via connects two or more inner layers but does not go through to an outer layer.

Delivery Terms	EXW, FCA, FAS, FOB, CFR, CIF, CPT, CIP, DAF, DES, DEQ, DDU, DDP
Payment Terms	T/T, Paypal, Western Union, D/P, D/A, L/C etc
Lead Time	Sample 3 ~ 5 days
	Mass production 1 week ~ 2 weeks
Service	OEM
Packing	Export cartons with ESD bag

PRODUCT PARAMETERS

[ Layer count ] 8 layers
[ Board thickness ] 1.6 mm
[ Dimension ] 165*105mm
[ Raw material ] FR4
[ Copper thickness on the board surface ] ≥70um
[ Surface finishing ] Immersion Gold [ Supply Ability ] 30,000 sq.m./month
[ Application ] Mobile Phone, GPS tracking, HD Digital Camera, IC-Substrate etc.